Boost for India’s semiconductor prowess! Tata Electronics starts exporting chip samples to partners in Japan, US, Europe

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Tata Electronics Ltd has commenced exporting a restricted variety of semiconductor chips packaged at its pilot line in its Bengaluru-based R&D centre, in accordance to sources accustomed to the matter. These packaged chips are being despatched to a few of Tata Electronics’ partners positioned in Japan, the US, and Europe. This growth comes because the Tata group firm prepares for its new chip packaging unit in Assam and a $10 billion chip foundry in Gujarat.
According to an ET report quoting a supply, “Tata Electronics has packaged chips there which they are sending to customers right now outside the country. They have multiple partners and are expanding their customer base. Some of these (products) are still in the pilot stage.”
Another individual revealed that the corporate can be shut to efficiently finishing a tape-out of semiconductor chips in numerous nodes, together with 28, 40, 55, and 65 nm, in addition to some larger nodes. The tape-out is the ultimate results of the designing course of for built-in circuits or printed circuit boards earlier than they’re despatched for manufacturing.

Semiconductor chips

The individual added, “There are multiple rounds before a successful tape-out. So, some of these products will be in advanced stages of R&D and they will be sent to select customers to obtain feedback for testing and improvement. Commercial production is slated for 2027.”
The chips which have been packaged and are at present being exported by Tata Electronics could possibly be used in numerous merchandise as they haven’t been designed for a selected objective. The supply defined, “When you package the chips, it really does not matter what the chips are used for. It is just a matter of when you package them and prepare them to be used. Tata Electronics has products in multiple areas.”
In April, the monetary each day reported that Tata Electronics had entered right into a strategic settlement with Tesla to present semiconductor chips for the latter’s worldwide operations. However, Tata Electronics didn’t reply to ET’s inquiries relating to this matter.
According to Neil Shah, vp at market analysis agency Counterpoint Research, it’s essential for Tata Group to start showcasing its chip designing and manufacturing talents to potential purchasers and partners earlier than the fabs are operational in the subsequent 30-36 months. Shah advised that Tata might leverage its complete experience and imaginative and prescient from the early semiconductor design growth work the corporate has been engaged in, both by Tata Elxsi, which has collaborations with Renesas and Lattice Semi, or by its inside department, Sankhya Labs.
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“Tata Electronics should set up solid front-end processes for co-design, testing and quality assurance processes for final production chip tape-outs when the fab is up,” he stated. “They must also formulate diligent back-end ATMP processes, services and pilots to achieve global manufacturing standards, lucrative yield rates and become a one-stop shop for both semiconductor design and manufacturing in India.”
The Tata group’s chip foundry in Dholera, established in partnership with Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC), has a deliberate capability of up to 50,000 wafer starts per 30 days. The facility is anticipated to manufacture chips in superior nodes akin to 28 nm and 40 nm, in addition to some legacy or mature nodes like 55 nm, 90 nm, and 110 nm.
The Tata-PSMC three way partnership is about to give attention to manufacturing chips in particular nodes earlier than transitioning to the 22 nm section. Currently, a number of small and medium-scale packaging corporations in India, together with Tessolve Semiconductor, CDIL, and SCL, are engaged in comparable actions. However, consultants recommend that their scale of operations is not going to match that of bigger gamers like Micron or Tata Group.
In addition to the foundry, Tata Group can be creating an outsourced meeting and testing (OSAT) unit in Assam. This essential step in the semiconductor worth chain includes assembling or packaging wafers produced by semiconductor fabs and testing them earlier than they’re used in the ultimate product.
CG Power can be engaged on a chip meeting and testing unit in Sanand, Gujarat. Other OSAT vegetation, such because the one introduced by the HCL Group-Foxconn group three way partnership and one other by Hiranandani Group’s Tarq Semiconductors in partnership with Kaynes Technology, are at present awaiting authorities approval.


Nilesh Desai
Nilesh Desaihttps://www.TheNileshDesai.com
The Hindu Patrika is founded in 2016 by Mr. Nilesh Desai. This website is providing news and information mainly related to Hinduism. We appreciate if you send News, information or suggestion.

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