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Taiwan’s Foxconn and India’s HCL Group fashioned a three way partnership to arrange an Outsourced Semiconductor Assembly & Test (OSAT) facility in Greater Noida.
PM Modi launching then HCL-Foxconn semiconductor facility in UP.
Prime Minister Narendra Modi on Saturday laid the inspiration stone of the HCL-Foxconn semiconductor facility in Uttar Pradesh, calling it a key milestone for the nation’s self-reliance in semiconductor chips.
“We are proud that Uttar Pradesh is changing into part of the semiconductor ecosystem within the nation. This semiconductor unit will give new recognition to the state. Moreover, it can enhance employment, because the institution of a semiconductor facility attracts ancillary industries, which can in the end generate extra jobs,” Modi said in a virtual address.
Taiwan’s Foxconn and India’s HCL Group formed a joint venture, called India Chip Private Limited, to set up an Outsourced Semiconductor Assembly & Test (OSAT) facility at YEIDA (Yamuna Expressway Industrial Development Authority) in Greater Noida. The advanced facility is expected to be operational by 2028.
In his address, PM Modi said a weak supply chain of tiny chips during the Covid-19 pandemic halted development of several economies and stopped work at various factories. “Developed India will be built only when India is self-reliant. For this, Made in India chip is very important. Whatever India is doing in the field of technology in this decade, it will become foundation of our capability in the 21st century,” Modi stated.
The institution of the HCL-Foxconn semiconductor facility in Uttar Pradesh is a step in direction of technological self-reliance. It will enhance India’s presence within the international chip ecosystem.https://t.co/DNY4D9MDUz— Narendra Modi (@narendramodi) February 21, 2026
The Prime Minister additionally stated 4 semiconductor items, out of the ten permitted underneath the India Semiconductor Mission, are set to start manufacturing within the nation. “If India’s chips are made in India, we is not going to need to depend on others for the tech manufacturing wants. Digital India, semiconductor chips, EVs, 5G, and AI are the soul of on a regular basis wants. If we’ve got chips of our personal, our progress in each sector will stay unimpeded,” he said.
HCL Group has earmarked an investment of Rs 3,700 crore over the next few years in the facility that will produce display driver chips. The investment is expected to create over 3,500 direct and indirect jobs, build local supply chains, and attract ecosystem partners across the semiconductor value chain.
UP Chief Minister Yogi Adityanath and Union IT Minister Ashwini Vaishnaw were also present on the occasion. They were joined by Roshni Nadar Malhotra, chairperson, HCL Group, and Bob Chen, president (semiconductor business group), Hon Hai Technology Group (Foxconn).
“In the last 11 years, the Prime Minister has established India as a powerhouse of electronics manufacturing. India is now ranked third among nations that export electronics. In a month, 3.6 crore chips will be produced from this plant. The brain of the digital screens that you see will now be made in Jewar,” Union Electronics and IT Minister Ashwini Vaishnaw stated.
HCL Group Chairperson Roshni Nadar stated the three way partnership facility will cater to the necessities of each home and worldwide markets. Bob Chen additionally addressed the occasion, saying, “We wish to set up dependable semiconductor meeting and testing facility in India. We look ahead to rising collectively and contributing to India’s progress in international know-how panorama.”
(with inputs from PTI)
February 21, 2026, 18:54 IST
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